Talent concept

Requirements for talents: proactive, loyal to their duties, innovative, and willing to share;

Commitment to talent: suitable for the individual, equal opportunities, moderate guidance, and hard cultivation;

Expectations for talents: Take the company's career as one's own, grow together with the company, and share achievements.


Talent concept

position name

Number of recruiters

Work location

Release time

RF/Microwave Chip Application Engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Lead or participate in the design team to complete the research and development and production of a series of RF/Microwave circuit (>10GHz) chip test circuit boards and customer application circuit boards, complete chip testing and organize technical documents. The RF part of the chip includes PAs, LNAs, Mixers, VCOs, PLLs, VGAs, etc., while the digital part includes SPI, I2C, digital logic, ARM, etc;

2. Use relevant EDA tools to design schematic diagrams and circuit board diagrams;

3. Assist/participate in layout engineers to optimize chip layout and wiring;

4. Assist/participate in chip design engineers in correcting chip design errors or optimizing chip technical specifications.


Requirement:

1. 2+years of experience in RF/microwave chip application, proficient in schematic design, PCB circuit board, RF matching and debugging;

2. Have the ability to test/debug wireless communication chips, and be able to use testing instruments such as oscilloscopes and spectrographs;

3. Have a sense of teamwork, be good at communication, work steadfastly, and have a strong sense of responsibility;

4. Familiarity with relevant EDA tools is preferred;

5. Design experience in circuits with operating frequencies above 10GHz is preferred;

6. Experience in designing RF transceivers and their modules PA, LNA, Mixer, VCO, PLL, VGA, and other circuits is preferred;

7. Bachelor's degree or above in Electronic Engineering/Microelectronics/Computer Science or Engineering.


IC Testing/Verification Engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

We will work with IC design engineers to test and validate RFIC and Analog/Mixed signal IC chips, and conduct statistical analysis of the test results.


Requirement:

1. Over 1 year of experience in testing/verifying RFIC and Analog/Mixed signal IC chips;

2. Understand IC technical parameters, have experience in RF circuit PCB board level design, and work experience in NI Labview platform is preferred;

3. Proficient in operating testing instruments: spectrum analyzer, vector network analyzer, noise analyzer, etc;

4. Proficient in operating RF probe stations and having experience in on wafer testing;

5. Familiar with EM emulators such as HFSS, Momentum, Sonnet, etc;

6. Bachelor's degree in Electronic Engineering/Microelectronics/Computer Science.


Digital IC Design Engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Digital design, verification, synthesis, simulation, and static timing analysis based on Verilog language;

2. Serial interface circuit design, such as I2C, SPI, etc;

3. Design for testability, including scan chain insertion, test mode generation, etc;

4. Evaluate and identify IC's and their demonstration boards;

5. Assist in completing various tasks related to the mixed signal ASIC design process, such as design, validation, synthesis, layout, wiring, testing, LVS, DRC, etc;

6. Assist in supporting customer applications.

Requirement:

1. 2+years of experience in digital IC design;

2. Have a sense of teamwork, be good at communication, work steadfastly, and have a strong sense of responsibility;

3. Bachelor's degree in Electronic Engineering/Microelectronics/Computer Science.


Experience in the following is preferred:

1. Have experience in serial interface design, such as SPI, SMBUS, I2C master/slave, etc;

2. Have relevant experience in high-speed digital design (Semi flow: customer layout+ASIC flow);

3. Possess solid knowledge of digital circuit modules, especially in high-speed asynchronous circuit design;

4. Proficient in Verilog RTL code, validation, and debugging;

5. Practical experience in EDA tools such as Cadence NC-Sim, Synopsys DC, PT, etc.


Senior Analog IC Design Engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Lead or participate in the design team to complete a series of analog/mixed signal circuit designs, such as ADC, reference source, operational amplifier, baseband amplifier, etc;

2. Design circuits using 0.35um, 0.18um SiGe processes and 0.35um, 0.18um, 90/40/28nm CMOS processes;

3. Assist/guide layout engineers in completing layout design;

4. Assist/guide testing/validation engineers in completing the writing of testing/validation processes and chip testing.

Requirement:

1. 3+years of experience in designing analog/mixed signal circuits in SiGe or CMOS processes;

2. Capable of testing/debugging AD converters and baseband amplifier chips;

3. Have a sense of teamwork, be good at communication, work steadfastly, and have a strong sense of responsibility;

4. Bachelor's degree in Electronic Engineering/Microelectronics/Computer Science.


Experience in the following is preferred:

1. Familiar with the design, layout, parasitic parameter extraction and validation in EDA tool environments such as Cadence Virtuoso, AMS, Calibre/Assura, and ADS;

2. Direct experience in designing, modeling, and simulating customized mixed signal circuits;

3. Have experience in designing circuits such as SAR/sigma delta ADC, band gap reference sources, operational amplifiers, etc;

4. Familiar with Verilog, Matlab, etc.


IC layout engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Collaborate with layout design team or lead layout design team members to complete chip layout design;

2. Responsible for communicating with design engineers on circuit issues and addressing all issues encountered during the physical design process of chip layouts;

3. Responsible for debugging and resolving LVS, DRC, and other layout issues, and tape-out the chips to the foundry.


Requirement:

1. Over 1 year of RF&Analog/Mixed signal IC layout design experience;

2. It is necessary to understand Cadence Virtuoso Layout Editor and validation tools such as Calibre, Dracula, and Hercules;

3. Understand some electrical related issues, such as electron migration (EM), coupling, and RC parasitism;

4. Ability to write code on layouts and validation tools to improve efficiency;

5. Have a sense of teamwork, be good at communication, work steadfastly, and have a strong sense of responsibility;

6. Bachelor's degree in Electronic Engineering/Microelectronics/Computer Science.


RF/Microwave IC Design Engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Lead or participate in the design team to complete a series of RF/Microwave circuit (>10GHz) designs, including PAs, LNAs, Mixers, VCOs, PLLs, VGAs, etc;

2. Design circuits using 0.35um, 0.18um SiGe processes and 0.35um, 0.18um, 90nm CMOS processes;

3. Assist/guide layout engineers in completing layout design;

4. Assist/guide testing/validation engineers in completing the writing of testing/validation processes and chip testing.


Requirement:

1. 3+years of experience in SiGe&CMOS RF/microwave IC design;

2. Have the ability to test/debug wireless communication chips;

3. Familiar with the design, layout, parasitic parameter extraction and validation in EDA tool environments such as Cadence Virtuoso, Calibre/Assura, and ADS;

4. Familiar with electromagnetic simulators such as HFSS, Momentum, Sonnet, EMX, etc;

5. Design experience in circuits with operating frequencies above 10GHz is preferred;

6. Experience in designing RF transceivers and their modules PA, LNA, Mixer, VCO, PLL, VGA, and other circuits is preferred;

7. Bachelor's degree in Electronic Engineering/Microelectronics/Computer Science.


Senior Embedded Software Engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Lead or participate in the design team to complete a series of control algorithm software designs for sensors or custom communication systems based on RF/Microwave chips (>5GHz), conduct algorithm development, code writing, system debugging based on chip test circuit boards or customer application circuit boards, and complete corresponding technical document organization;

2. Use programming software such as Keil/IAR for code writing and debugging, and independently complete embedded software programming;

3. Participate in simulation verification of the digital part of the chip (SPI, I2C, digital logic, 8051 or ARM embedded processors);

4. Assist/participate in the design and validation of DEMO or customer application reference solutions.


Requirement:

1. 2+years of experience in processor chip applications, proficient in C language programming and debugging;

2. Have a sense of teamwork, be good at communication, work steadfastly, and have a strong sense of responsibility;

3. FPGA development experience or 8051/ARM microcontroller development experience, proficient in programming tools such as Keil/IAR, and having written and debugged real-time control programs related to various peripherals (SPI, I2C, UART, ADC, DAC, PWM, etc.);

4. Understand the working principles of system hardware, and have programming experience in wireless communication chips and wireless IoT sensor chips is preferred;

5. Bachelor's degree or above in Electronic Engineering/Microelectronics/Computer/Communication Engineering.


sales engineer

Slightly

Shenzhen

2023-11-20

Responsibility:

1. Promote communication related RF/microwave/millimeter wave ICs, microwave/millimeter wave radar ICs, and power management ICs, providing professional guidance and support to customers;

2. Develop new customers, maintain existing customers, handle customer inquiries, samples, orders, and follow up on payments, promote sales achievement and growth, and achieve performance goals;

3. Understand customer, market, and product line dynamics, grasp industry market trends, conduct sales forecasting and market exploration;

4. Maintain efficient communication with team leaders, technical support, and relevant support departments, and respond to customer demands in a timely manner.


Requirement:

1. College degree or above, preferably in marketing or electronics related fields, with at least 1 year of sales experience in electronic components or products;

2. Experience in IC factory sales is preferred;

Familiar with the communication industry, intelligent lighting industry, smart home industry, and Internet of Things industry are preferred.


Phone

198 3286 8692

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